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Material

RF-4, Aluminum

layers:

2-30 layers

warp and twist

<0.5%

surface treatment

hasl, OSP, ENIG, gold finger, Au panel

surface treating process of inner layer

brown oxide

max size

457 x 610 mm

Board Thickness

0.2mm-3.8mm (±10%)

outer layer line width/space

±3mil (75μm)/±3mil (75μm)

peel strength of line

≥6lb/in (107g/mm)

min inner pad size

pad annular

0.13mm (5mil)

min core thickness

0.10mm (4mil)

inner copper foil thickness

no Cu clad

1/2oz (17μm)

outer layer base copper thickness

1/2oz (17μm)

finished panel thickness

0.2mm-4.0mm

tolerance of thickness of finished panel

≤1.0mm

4-8 layers:               ±12%

1.0mm-2.0mm

4-8 layers:               ±8%
≥10 layers:             ±10%

≥2.0mm

                                  ±10%

registration of layer to layer

±3mil (76μm)

minimum drilling diameter

0.15mm

minimum diameter of finished hole

0.10mm

accuracy of finished hole

±2mil (50μm)

tolerance of drilled slot

±3mil (76μm)

tolerance of PTH diameter

±2mil (50μm)

tolerance of NPTH diameter

±1mil (25μm)

max AR of PTH

10:1

PTH hole copper thickness

0.4-2mil (10-50μm)

image to image tolerance

±3mil (75μm)

etching tolerance

±1mil (25μm)

solder mask thickness

end

0.4-1.2mil (10-30μm)

corner

≥0.2mil(5μm)

on substrate

solder mask hardness

6H

nickel thickness for electroless nickel and immersion gold

120u"/240u"(3um/6um)

gold thickness for electroless nickel and immersion gold

2u"/6u"(0.05um/0.15um)

impedence control

50Ω±10%