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Brand:aa
Product detail:
| PCB Capability: | ||
| 1 | Layers | 2 ~ 30 layers |
| 2 | Material | FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium |
| 3 | Finished Board Thickness | 0.2mm ~ 7.0mm |
| 4 | Copper Thickness | 1/3oz ~ 7oz |
| 5 | Surface Finishing | HASL, Lead Free HAL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon |
| 6 | Min. Trace Width/Space | 3mil |
| 7 | Min. Finish Hole Size | 0.1mm |
| 8 | Hole tolerance | PTH:±0.076mm, NTPH:±0.05mm |
| 9 | Soldermask Color | Green, White, Black, Red, Yellow, Blue, |
| 10 | Silkscreen Color | White, Black, Yellow, Blue |
| 11 | Impedance Control | +/-10% |
| 12 | Profiling Punching | Routing, V-CUT, Chamfer |
| 13 | Special holes | Blind/Buried holes, Countersunk holes |
| 14 | Reference Standard | IPC-A-600G Class 2, Class 3 |
| 15 | Certificate | UL, ISO9001, ROHS, SGS |
| 16 | Package | Vaccum & Carton |
| PCB Assembly Capability: | ||
| 1 | Min. IC Pitch | 0.30mm |
| 2 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
| 3 | Min. Chip Placement | 01005 |
| 4 | Max. PCB Size | 410 x 600mm |
| 5 | Min. PCB Thickness | 0.35mm |
| 6 | Maximum BGA Size | 74 x 74mm |
| 7 | BGA Ball Pitch | 1mm ~ 3mm |
| 8 | BGA Ball Diameter | 0.4mm ~ 1mm |
| 9 | QFP Lead Pitch | 0.38mm ~ 2.54mm |
| 10 | Package | Anti-static Bubble Bag & Carton |
