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Wells Electronic Technology Ltd.

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 Wells Electronic Technology Ltd.

China

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OEM Electronic PCB layout/Electronic Circuit factory
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Product:
Brand: aa 
Price: 10.00USD/ 
MOQ: 1  
Total supply:
Delivery time: From the date of payment from the buyer within days of delivery
update time: 2016-07-21 05:36  Valid to:Long-term effective
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Electronic Circuit factory  

 

    Wells Electronic Technology Ltd is a hi-tech company, which specializes in fabricating high precision, high density and high reliability PCB from 1 to 30 layers for over 10 years, our products are used in many industries including, industrial control, power electronics, security electronics, medical electronics,etc

 

1.Detailed Specification of PCB Manufacturing 

 

1

Layers

1 ~ 30 layers 

2

Material

FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium

3

Finished Board Thickness

0.2mm ~ 7.0mm

4

Copper Thickness

1/3oz ~ 7oz

5

Surface Finishing

HASL, Lead Free HAL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon

6

Min. Trace Width/Space

3mil

7

Min. Finish Hole Size

0.1mm

8

Hole tolerance

PTH:±0.076mm, NTPH:±0.05mm

9

Soldermask Color

Green, White, Black, Red, Yellow, Blue,

10

Silkscreen Color

White, Black, Yellow, Blue

11

Impedance Control

+/-10%

12

Profiling Punching

Routing, V-CUT, Chamfer

13

Special holes

Blind/Buried holes, Countersunk holes

14

Reference Standard

IPC-A-600G Class 2, Class 3

15

Certificate

UL, ISO9001, ROHS, SGS

16

Package

Vaccum & Carton

 

PCB Assembly Capability:

1

Min. IC Pitch

0.30mm

2

Foot Pin

SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA

3

Min. Chip Placement 

01005

4

Max. PCB Size

410 x 600mm

5

Min. PCB Thickness

0.35mm

6

Maximum BGA Size

74 x 74mm

7

BGA Ball Pitch

1mm ~ 3mm

8

BGA Ball Diameter

0.4mm ~ 1mm

9

QFP Lead Pitch

0.38mm ~ 2.54mm

10

Package

Anti-static Bubble Bag & Carton

 

 

 

2. Product Description
1. Complete products contract PCB assembly and manufacturing services
2. Circuit boards to 30 layers PCB layout, fabrication, PCB assembly and box build
3.Active and passive components source is directly from original manufacturer
4. Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly
5. High-precision 0201 size components SMT technology and lead-free
6. IC pre-program
7. High-precision E-Testing include: ICT in circuit, BGA repaire device, etc.
Prototype and Mass Printed Board Assembly (PCBA)

 

 

 

3.PCB & PCBA capability and services:

 

1.Single-sided, double side & multi-layer PCB with competitive price, good quality and excellent service.
2. Cem-1, fr-4, fr-4 high tg, aluminum base material.
3. Hal, hal lead free, immersion gold/ silver/tin, osp surface treatment.
4.100% e-test.

 

  

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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